As an important packaging equipment in semiconductor industry and electronics industry, LED Die Bonder is mainly used for lead cabinet and press plate of various gold wire ultrasonic welding equipment, as well as various chip mounting equipment. The equipment is generally controlled by computer and equipped with CCD image sensing system. First, the CCD system scans, determines the correct path, and then inputs the set program to complete the whole work flow. The swing arm shaft and other mechanical structures complete the wafer handling action
ADT-8989H1 Control Card
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project name |
LED Die Bonder |
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Device configuration (single device) |
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Name |
model |
quantity |
introduction |
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Pulse motion control card |
ADT-8989H1 |
1 |
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industrial computer |
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1 |
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linear motor |
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6 |
Motor customization |
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Driver |
ODSAP6A401GB |
6 |
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Rotary servo |
MADLN35SE |
1 |
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servo motor |
MHMF0821C2 |
1 |
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Rotary servo |
MADLN25SE |
1 |
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servo motor |
MHMF0421C2 |
1 |
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facility request |
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precision |
±0.5um |
Control instruction cycle |
Less than 250us (At present, 125us version is given to the customer) |
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brief introduction |
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1, the equipment is used to fix the LED luminous crystal source dispensing to the LED luminous base 2. Main working process: CDD takes a photo of the crystal source disk to obtain the crystal source position (at the same time, another CCD takes a photo of the LED base to obtain the position of the base) → flyfork shaft crystal → flyfork crystal → dispensing →CCD photography effect on the dispensing position 3. The equipment is used in LED production industry, which belongs to the front end of LED manufacturing industry |
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industrial advantage |
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1, fully automatic solidification, one employee can take care of more than 10 machines 2, high processing efficiency, can be very good to maintain the consistency of products 3. In the future development, the solid-crystal, optical splitting and tape braiding can be combined to complete the complete production line of LED manufacturing |
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Equipment picture |
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